Product name: PCI-E board mounting

Industry: Optical Communication

Production time: March 26, 2012 Production

Overall density: low

Resistor capacitance packaging: 0402 (referring to the minimum packaging)

Chip density: high

Number of BGAs: 1

BGA density: 0.6mm (referring to the minimum density)

Plate thickness: 2.0mm

Material type: 53 types

Aesthetic Index: ★★★★★★