Product Name: High Density DSP Signal Core Board Installation
Industry: High speed DSP signal processing core board
Production time: March 20th, 2012 Production
Overall density: high
Resistor capacitance packaging: 0402 (referring to the minimum packaging)
Chip density: high
Number of BGAs: 5
BGA density: 0.6mm (referring to the minimum density)
Plate thickness: 2.0mm
Material type: 96 types
Aesthetic Index: ★★★★★★
Product name: High speed DSP signal acquisitionIndustry: High speed signal processing core boardOver···
Our company has advanced intelligent equipment and perfect production process, introducing four new ···
Our company has advanced intelligent equipment and perfect production process, introducing four new ···
Precision SMT chip processingProduct Name: High Density DSP Signal Core Board InstallationIndustry: ···
Our company has advanced intelligent equipment and perfect production process, introducing four new ···
HYSTRONG MALAYSIA SDN. BHD. can provide you with high density SMT chip processing One stop service i···